3D IC Stacking Technology
Détail de l'offre

3D IC Stacking Technology

Banqiu Wubookshop.ltLTLT
169,74 €
192,95 €
-12%
Boutique
bookshop.lt
Pays
LTLT
Description

12% off from bookshop.lt in LT. Now €169.74, down from €192.95.

  • Current live price is €169.74 versus €192.95, which works out to 12% off.
  • The price has moved up from €154.74 to €169.74 during the tracked period, with a range between €154.74 and €169.74.
  • This product currently has 2 tracked variants. DealFerret links this result back to bookshop.lt in LT.
Description de la boutique

Explore the cutting-edge advancements in three-dimensional integrated circuit stacking technology with the insightful book 3D IC Stacking Technology by Banqiu Wu. Published by McGraw-Hill Education - Europe in 2011, this comprehensive hardback edition spans 544 pages and delves into the innovative realm of microelectronic packaging. Ideal for professionals and enthusiasts in the fields of technology and engineering, especially those focused on electronics and semiconductors, this book provides a thorough understanding of the latest techniques and methodologies in 3D IC technology. Enhance your knowledge and stay ahead in the rapidly evolving semiconductor landscape with this essential resource.

Historique des prix
DatePrixPrix de référence% Réduction
10 avr. 2026169,74 €192,95 €-12%
5 avr. 2026157,74 €180,95 €-13%
Boutique
Boutique
bookshop.lt
Pays
LTLT
SKU
9780071741958
Mots-clés
2011Banqiu WuHardbackK00M/DMcGraw-Hill Education - EuropeMicroelectronic packagingTECHNOLOGY & ENGINEERING / Electronics / SemiconductorsThree-dimensional integrated circuitsTJFCUnited States
bookshop.lt
169,74 €
192,95 €
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