3D IC Stacking Technology
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3D IC Stacking Technology

Banqiu Wubookshop.ltLTLT
169,74 €
192,95 €
-12%
Parduotuvė
bookshop.lt
Šalis
LTLT
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12% off from bookshop.lt in LT. Now €169.74, down from €192.95.

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Explore the cutting-edge advancements in three-dimensional integrated circuit stacking technology with the insightful book 3D IC Stacking Technology by Banqiu Wu. Published by McGraw-Hill Education - Europe in 2011, this comprehensive hardback edition spans 544 pages and delves into the innovative realm of microelectronic packaging. Ideal for professionals and enthusiasts in the fields of technology and engineering, especially those focused on electronics and semiconductors, this book provides a thorough understanding of the latest techniques and methodologies in 3D IC technology. Enhance your knowledge and stay ahead in the rapidly evolving semiconductor landscape with this essential resource.

Kainų istorija
DataKainaĮprasta kaina% Nuolaida
2026-04-10169,74 €192,95 €-12%
2026-04-05157,74 €180,95 €-13%
Parduotuvė
Parduotuvė
bookshop.lt
Šalis
LTLT
SKU
9780071741958
Žymos
2011Banqiu WuHardbackK00M/DMcGraw-Hill Education - EuropeMicroelectronic packagingTECHNOLOGY & ENGINEERING / Electronics / SemiconductorsThree-dimensional integrated circuitsTJFCUnited States
bookshop.lt
169,74 €
192,95 €
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